Thank you for your interest in DEL1403N-70LM. Civil Aviation 360 offers an unmatched amount of premium NSN parts to various industries. Microcircuit Memory is an item listed with the NSN 5962-01-248-5010 and is manufactured by Sgs Thomson Microelectronics Inc. If you are interested in beginning the purchasing process for this particular item DEL1403N-70LM, please finish filling out the provided Instant RFQ form with details like quantity and contact information. After submission, a staff member will contact you in 15 minutes or less with a personalized quote.
Civil Aviation 360 provides customers with a large inventory of NSN part such as DEL1403N-70LM that are available for immediate purchase. A National Stock Number (NSN) is a number used to help classify items as they make their way through the federal supply system. Each NSN is unique, and the several digits describe different qualities like name, manufacturer, part number, and more. This classification system was created to eliminate confusion and duplication of orders, particularly in the United States Military Services. Since its first use after World War II, it has been officially recognized by the U.S. DOD and other NATO countries. For your convenience, 5962-01-248-5010 is also listed with its CAGE Code: 60911 and manufacturer: Sgs Thomson Microelectronics Inc. All items that Civil Aviation 360 provides come with expedited shipping and manufacturer trace documentation, as applicable.
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5962-01-248-5010 Item Description: Microcircuit Memory | 5962 | 012485010 | 0 | N | D | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| 7 | D | A | 0 | |||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| Del1403n-70lm | 2 | 9 | 5 |
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 0.425 INCHES NOMINAL |
| ADAT | BODY WIDTH | 0.290 INCHES NOMINAL |
| ADAU | BODY HEIGHT | 0.085 INCHES NOMINAL |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 1.0 WATTS |
| AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | ELECTROSTATIC SENSITIVE AND HERMETICALLY SEALED AND BURN IN AND HIGH RELIABILITY AND MONOLITHIC |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQSZ | INCLOSURE CONFIGURATION | LEADLESS FLAT PACK |
| CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 17 INPUT |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 7.0 VOLTS MAXIMUM POWER SOURCE |
| CZEQ | TIME RATING PER CHACTERISTIC | 70.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 70.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| CZER | MEMORY DEVICE TYPE | RAM |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| TTQY | TERMINAL TYPE AND QUANTITY | 20 LEADLESS |
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